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DTSTART:19700308T020000
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BEGIN:VEVENT
DTSTAMP:20250522T212948Z
LOCATION:Exhibit Hall A
DTSTART;TZID=America/Denver:20240730T113000
DTEND;TZID=America/Denver:20240730T120000
UID:siggraph_SIGGRAPH 2024_sess505@linklings.com
SUMMARY:Supermicro Presents Infrastructure for 3D Workflows with Generativ
 e AI Capabilities
DESCRIPTION:Infrastructure for 3D Workflows with Generative AI Capabilitie
 s\n\nAs 3D graphics professionals are rapidly seeking to integrate generat
 ive AI into their workflows, the supporting IT infrastructure must be reev
 aluated. The hardware and software require capabilities to deliver perform
 ance for both new AI tools and existing 3D applications. Supermicro presen
 ts best-i...\n\n\nRegistration Category: Exhibitor, Full Conference, Full 
 Conference Supporter, Experience, Exhibits Only, Exhibitor Full Conference
 , Exhibitor Experience, Tuesday
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